Bidalert ID: BABID14178030
Tender ID: GEM/2025/B/7001649
Closing Date: 23-Jan-2026 10:00 AM
Tender Details: Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinis
Dept: Ministry of Electronics and Information Technology - Department of Electronics and Information Technology
EMD: Refer
Exemption:
ECV: Refer